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M5M5V108DFP-70H

Features: Directly TTL compatible : All inputs and outputsEasy memory expansion and power down by S1,S2Data hold on +2V power supplyThree-state outputs : OR - tie capabilityOE prevents data contention in the I/O busCommon data I/OPackage M5M5V108DFP ```````````` 32pin 525mil SOP M5M5V108DVP,RV ```...

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SeekIC No. : 004406322 Detail

M5M5V108DFP-70H: Features: Directly TTL compatible : All inputs and outputsEasy memory expansion and power down by S1,S2Data hold on +2V power supplyThree-state outputs : OR - tie capabilityOE prevents data contenti...

M5M5V108DFP-70H Data Sheet

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Part Number:
M5M5V108DFP-70H
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

Directly TTL compatible : All inputs and outputs
Easy memory expansion and power down by S1,S2
Data hold on +2V power supply
Three-state outputs : OR - tie capability
OE prevents data contention in the I/O bus
Common data I/O
Package
  M5M5V108DFP ```````````` 32pin 525mil SOP
  M5M5V108DVP,RV ```````````` 32pin 8 X 20 mm2 TSOP
  M5M5V108DKV,KR ```````````` 32pin 8 X 13.4 mm2 TSOP


Application

Small capacity memory units


Pinout

Connection Diagram


Specifications

Symbol Parameter Conditions Ratings Unit
Vcc Supply voltage




 With respect to GND 0.3*~4.6 V
VI


 Input voltage 0.3*~Vcc + 0.3
(Max 4.6)		 V
VO Output voltage 0~Vcc V
Pd
 Power dissipation Ta=25 700 mW
Topr Operating temperature   0~70
Tstg Storage temperature   65~150
* 3.0V in case of AC ( Pulse width  30ns )


Description

The M5M5V108DFP,VP,KV are a 1048576-bit CMOS static RAM organized as 131072 word by 8-bit which are  fabricated using highperformance triple-polysilicon and double metal CMOS technology.The use of thin film transistor (TFT) load cells and CMOS periphery result in a high density and low power static RAM.

They are low standby current and low operation current and ideal for the battery back-up application.

The M5M5V108DVP,KV are packaged in a 32-pin thin small outline package which is a high reliability and high density surface mount device(SMD).




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