M5M5J167KT

Features: `Single 2.7~3.6V power supply`Small stand-by current: 0.2A (2.0V, ty p.)`No clocks, No ref resh`Data retention supply v oltage =2.0~3.6V`All inputs and outputs are TTL compatible.`Easy memory expansion by S1#, S2, BC1# and BC2#`Common Data I/O`Three-state outputs: OR-tie capability`OE pr...

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M5M5J167KT Picture
SeekIC No. : 004406317 Detail

M5M5J167KT: Features: `Single 2.7~3.6V power supply`Small stand-by current: 0.2A (2.0V, ty p.)`No clocks, No ref resh`Data retention supply v oltage =2.0~3.6V`All inputs and outputs are TTL compatible.`Easy mem...

floor Price/Ceiling Price

Part Number:
M5M5J167KT
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

`Single 2.7~3.6V power supply
`Small stand-by current: 0.2A (2.0V, ty p.)
`No clocks, No ref resh
`Data retention supply v oltage =2.0~3.6V
`All inputs and outputs are TTL compatible.
`Easy memory expansion by S1#, S2, BC1# and BC2#
`Common Data I/O
`Three-state outputs: OR-tie capability
`OE prev ents data contention in the I/O bus
`By te f unction (x8 mode) av ailable by By te# & A-1.
`Process technology: 0.18m CMOS
`Package: 52pin 10.79mm x 10.49mm TSOP [0.4mm pin pitch]



Pinout

  Connection Diagram


Specifications

Symbol
Parameter
Conditions
Ratings
Unit
Vcc
Supply voltage
With respect to GND
-0.3~6.0
V
V I
Input voltage
With respect to GND
- 0.3* ~ Vcc + 0.3 (max. 4.6V)
V
V O
Output voltage
With respect to GND
0 ~ Vcc
V
Topr1
Operating temperature 1
Ta = 25°C
700
°C
Topr2
Operating temperature 2
-40 ~ +85
°C
Tstg
Storage temperature
- 65 ~ +150
°C



Description

The M5M5J167KT is a f amily of low v oltage 16Mbit static RAMs organized as 1048576-words by 16-bit / 2097152-words by 8-bit, f abricated by Mitsubishi's high-performance 0.18m CMOS technology . The M5M5J167KT is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es.

The M5M5J167KT is made by stacked-micro-package technology and two chips of 8Mbits SRAMs are assembled in one package. By using this package technology , small package size can be achieved f or highdensity SRAM.

The M5M5J167KT is packaged in a 52pin-TSOP with the outline of 10.79mm x 10.49mm, and pin pitch of 0.40mm. It giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards.




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