Features: ` INTEGRATED ULTRA-LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERY`FREQUENCY TEST OUTPUT for REAL TIME CLOCK SOFTWARE CALIBRATION` YEAR 2000 COMPLIANT` AUTOMATIC POWER-FAIL CHIP DESELECT and WRITE PROTECTION` WATCHDOG TIMER` WRITE PROTECT VOLTAGE (VPFD = Power-Fai...
M48T37Y: Features: ` INTEGRATED ULTRA-LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERY`FREQUENCY TEST OUTPUT for REAL TIME CLOCK SOFTWARE CALIBRATION` YEAR 2000 COMPLIANT` AUTOMATIC PO...
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Symbol |
Parameter |
Value |
Unit | |
TA |
Ambient Operating Temperature |
Grade 1 |
0 to 70 |
|
Grade 6 |
40 to 85 |
|||
TSTG |
Storage Temperature (VCC Off, Oscillator Off) |
SNAPHAT |
40 to 85 |
|
SOIC |
55 to 125 |
|||
TSLD(2) |
Lead Solder Temperature for 10 seconds |
260 |
||
VIO |
Input or Output Voltages |
M48T37Y |
0.3 to 7 |
V |
M48T37V |
0.3 to 4.6 |
V | ||
VCC |
Supply Voltage |
M48T37Y |
0.3 to 7 |
V |
M48T37V |
0.3 to 4.6 |
V | ||
IO |
Output Current |
10 |
mA | |
PD |
Power Dissipation |
1 |
W |
Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage
to the device. This is a stress rating only and functional operation of the device at these or any
other conditions above those indicated in the operational section of this specification is not
implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect
reliability.
2. Soldering temperature not to exceed 260 for 10 seconds (total thermal budget not to exceed 150for
longer than 30 seconds).
CAUTION: Negative undershoots below 0.3V are not allowed on any pin while in the Battery Back-up mode.
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
The M48T37Y/37V TIMEKEEPER[ RAM is a 32Kb x8 non-volatile static RAM and real time clock. The monolithic chip is available in a special package which provides a highly integrated battery backed-up memory and real time clock solution.
The 44 lead 330mil SOIC package of M48T37Y/37V provides sockets with gold-plated contacts at both ends for direct connection to a separate SNAPHAT housing containing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process.
Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device surface- mounting. The SNAPHAT housing is keyed to prevent reverse insertion
The SOIC and battery packages of M48T37Y/37V are shipped separately in plastic anti-static tubes or in Tape &Reel form. For the 44 lead SOIC, the battery/crystal package (i.e. SNAPHAT) part number is "M4T28- BR12SH" or "M4T32-BR12SH".
Caution: Do not place the SNAPHAT battery/crystal top in conductive foam, as this will drain the lithium button-cell battery.
As Figure 3 shows, the static memory array and the quartz controlled clock oscillator of the M48T37Y/37V are integrated on one silicon chip.