Features: ` INTEGRATED ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT, and BATTERY` BYTEWIDE™ RAM-LIKE CLOCK ACCESS` BCD CODED YEAR, MONTH, DAY, DATE, HOURS, MINUTES, and SECONDS` TYPICAL CLOCK ACCURACY OF ±1 MINUTE A MONTH, AT 25°C` AUTOMATIC POWER-FAIL CHIP DESELECT and ...
M48T08Y,: Features: ` INTEGRATED ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT, and BATTERY` BYTEWIDE™ RAM-LIKE CLOCK ACCESS` BCD CODED YEAR, MONTH, DAY, DATE, HOURS, MINUTES, and SE...
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Symbol | Parameter | Value | Unit |
TA | Operating Temperature | 15 to 75 | |
TSTG | Storage Temperature (VCC, Oscillator Off) | 40 to 85 | |
TSLD(1,2) | Lead Solder Temperature for 10 seconds | 260 | |
VCC | Supply Voltage (on any pin relative to Ground) | 0.3 to 7 | V |
VIO | Input or Output Voltage | 0.3 to 7 | V |
IO | Output Current | 20 | mA |
PD | Power Dissipation | 1 | W |
Note: 1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
2. For SO package: Reflow at peak temperature of 215°C to 225°C for < 60 seconds (total thermal budget not to exceed 180°C for between 90 to 120 seconds).
The M48T08/18/08Y TIMEKEEPER® RAM is an 8K x 8 non-volatile static RAM and real time clock which is pin and functional compatible with the DS1643. The monolithic chip M48T08/18/08Y is available in two special packages to provide a highly integrated battery backed-up memory and real time clock so-lution.
The M48T08/18/08Y is a non-volatile pin and func-tion equivalent to any JEDEC standard 8K x 8 SRAM. It also easily fits into many ROM, EPROM,and EEPROM sockets, providing the non-volatility of PROMs M48T08/18/08Y without any requirement for special WRITE timing or limitations on the number of WRITEs that can be performed.
The 28-pin, 600mil DIP CAPHAT™ houses the M48T08/18/08Y silicon with a quartz crystal and a long- life lithium button cell in a single package.
The 28-pin, 330mil SOIC M48T08/18/08Y provides sockets with gold plated contacts at both ends for direct con-nection to a separate SNAPHAT® housing con-taining the battery and crystal. The unique design allows the SNAPHAT M48T08/18/08Y battery package to be mounted on top of the SOIC package after the completion of the surface mount process. Inser-tion of the SNAPHAT M48T08/18/08Y housing after reflow pre-vents potential battery and crystal damage due to the high temperatures required for device surface-mounting. The SNAPHAT housing is keyed to pre- vent reverse insertion.
The SOIC M48T08/18/08Y and battery/crystal packages are shipped separately in plastic anti-static tubes or in Tape & Reel form. For the 28 lead SOIC, the bat-tery/crystal package (e.g., SNAPHAT) part num-ber is "M4T28-BR12SH" or "M4T32-BR12SH"(see Table 17, page 24).