Features: • Performance range• Power supply : Vdd: 2.5V ± 0.2V, Vddq: 2.5V ± 0.2V• Double-data-rate architecture; two data transfers per clock cycle• Bidirectional data strobe(DQS)• Differential clock inputs(CK and CK)• DLL aligns DQ and DQS transition with CK t...
M470L3224BT0: Features: • Performance range• Power supply : Vdd: 2.5V ± 0.2V, Vddq: 2.5V ± 0.2V• Double-data-rate architecture; two data transfers per clock cycle• Bidirectional data strob...
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Features: • Power supply : Vdd: 2.5V ± 0.2V, Vddq: 2.5V ± 0.2V• Double-data-rate archi...
Features: • Power supply : Vdd: 2.5V ± 0.2V, Vddq: 2.5V ± 0.2V• Double-data-rate archi...
Features: • VDD : 2.5V ± 0.2V, VDDQ : 2.5V ± 0.2V for DDR266, 333• VDD : 2.6V ± 0.1V, ...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to Vss |
VIN, VOUT |
-0.5 ~ 3.66 |
V |
Voltage on VDD supply relative to VSS |
VDD |
-1.0 ~ 3.6 |
V |
Voltage on VDDQ supply relative to Vss |
VDDQ |
-0.5 ~ 3.6 |
V |
Storage temperature |
TSTG |
-55 ~ +150 |
|
Power dissipation |
PD |
8 |
W |
Short circuit current |
IOS |
50 |
mA |
The Samsung M470L3224BT0 is 32M bit x 64 Double Data Rate SDRAM high density memory modules based on first gen of 256Mb DDR SDRAM respectively.
The Samsung M470L3224BT0 consists of eight CMOS 16M x 16 bit with 4banks Double Data Rate SDRAMs in 66pin TSOPII(400mil) packages mounted on a 200pin glass-epoxy substrate. Four 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each DDR SDRAM.
The M470L3224BT0 is Dual In-line Memory Modules and intended for mounting into 200pin edge connector sockets.
Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible on both edges of DQS. Range of operating frequencies, programmable latencies and burst lengths allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.