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M40Z111

Features: `CONVERT LOW POWER SRAMs into VRAMs`PRECISION POWER MONITORING and OWER SWITCHING CIRCUITRY`AUTOMATIC WRITE-PROTECTION when VCC is OUT-OF-TOLERANCE`CHOICE of SUPPLY VOLTAGES and POWER-FAIL DESELECT VOLTAGES: M40Z111: VCC = 4.5V to 5.5V THS = VSS 4.5V VPFD 4.75V THS = VOUT 4.2V VPFD 4....

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SeekIC No. : 004405235 Detail

M40Z111: Features: `CONVERT LOW POWER SRAMs into VRAMs`PRECISION POWER MONITORING and OWER SWITCHING CIRCUITRY`AUTOMATIC WRITE-PROTECTION when VCC is OUT-OF-TOLERANCE`CHOICE of SUPPLY VOLTAGES and POWER-FAIL...

M40Z111 Data Sheet

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Part Number:
M40Z111
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

`CONVERT LOW POWER SRAMs into VRAMs
`PRECISION POWER MONITORING and OWER SWITCHING CIRCUITRY
`AUTOMATIC WRITE-PROTECTION when VCC is OUT-OF-TOLERANCE
`CHOICE of SUPPLY VOLTAGES and POWER-FAIL DESELECT VOLTAGES:
   M40Z111: VCC = 4.5V to 5.5V
                        THS = VSS 4.5V VPFD 4.75V
                        THS = VOUT 4.2V VPFD 4.5V
   M40Z111W:
                        VCC = 3.0V to 3.6V
                        THS = VSS 2.8V VPFD 3.0V
                        VCC = 2.7V to 3.3V
                        THS = VOUT 2.5 VPFD 2.7V
`LESS THAN 15ns CHIP ENABLE ACCESS PROPAGATION DELAY (for 5.0V device)
`PACKAGING INCLUDES a 28-LEAD SOIC and SNAPHAT® TOP (to be Ordered Separately)
`SOIC PACKAGE PROVIDES DIRECT
   CONNECTION for a SNAPHAT TOP which  CONTAINS the BATTERY 


Pinout

Connection Diagram


Specifications

Symbol
Parameter
Value
Unit
TA
 Ambient Operating Temperature
0 to 70
TSTG
 Storage Temperature (VCC Off) SNAPHAT
40 to 85
55 to 125
SOIC
TSLD (2)
 Lead Solder Temperature for 10 seconds
260
VIO
 Input or Output Voltages
0.3 to VCC +0.3
V
VCC
 Supply Voltage
0.3 to 7
V
IO
 Output Current
20
mA
PD
 Power Dissipation
1
W

Notes: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect reliability.
2. Soldering temperature not to exceed 260 for 10 seconds (total thermal budget not to exceed 150 for longer than 30 seconds).
CAUTION: Negative undershoots below 0.3 volts are not allowed on any pin while in the Battery Back-up mode.
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.




Description

The M40Z111/111W NVRAM Controller is a selfcontained device which converts a standard lowpower SRAM into a non-volatile memory.

A precision voltage reference and comparator monitors the VCC input for an out-of-tolerance condition.




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