Features: SUPPLY VOLTAGE VDDF = 2.7V to 3.3V VDDS = VDDQF = 2.7V to 3.3V VPPF = 12V for Fast Program (optional) ACCESS TIMES: 70ns and 85nsLOW POWER CONSUMPTIONELECTRONIC SIGNATURE Manufacturer Code: 20h Top Device Code, M36W832TE: 88BAh Bottom Device Code, M36W832BE: 88BBhPinoutSpecifications...
M36W832TE: Features: SUPPLY VOLTAGE VDDF = 2.7V to 3.3V VDDS = VDDQF = 2.7V to 3.3V VPPF = 12V for Fast Program (optional) ACCESS TIMES: 70ns and 85nsLOW POWER CONSUMPTIONELECTRONIC SIGNATURE Manufacturer Co...
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Features: MULTI-CHIP PACKAGE 1 die of 64 Mbit (4Mb x 16) Flash Memory 1 die of 16 Mbit (1Mb x 1...
Symbol |
Parameter |
Value |
Unit | |
Min |
Max | |||
TA |
Ambient Operating Temperature (1) |
40 |
85 |
°C |
TBIAS |
Temperature Under Bias |
40 |
125 |
°C |
TSTG |
Storage Temperature |
55 |
150 |
°C |
VIO |
Input or Output Voltage |
0.5 |
VDDQF +0.5 |
V |
VDDF , VDDQF |
Flash Supply Voltage |
0.6 |
4.1 |
V |
VPPF |
Program Voltage |
0.6 |
13 |
V |
VDDS |
SRAM Supply Voltage |
0.5 |
3.6 |
V |
Note: 1. Depends on range.
The M36W832TE is a low voltage Multiple Memory Product which combines two memory devices; a 32 Mbit boot block Flash memory and an 8 Mbit
SRAM. Recommended operating conditions do not allow both the Flash and the SRAM M36W832TE to be active at the same time.
The memory M36W832TE is offered in a Stacked LFBGA66 (12x8mm, 0.8 mm pitch) package and is supplied with all the bits erased (set to '1').