Features: • Package : SMD Top View Type (3 Chip in 1PKG)• 8.0 × 7.2 × 1.4 mm(L×W×H) size surface mount type• Viewing angle : extremely wide(120˚)• Technology : InGaN• Soldering methods : IR reflow soldering• ESD FreeSpecifications Item Symbol A...
LWM1070N3: Features: • Package : SMD Top View Type (3 Chip in 1PKG)• 8.0 × 7.2 × 1.4 mm(L×W×H) size surface mount type• Viewing angle : extremely wide(120˚)• Technology : InGaNR...
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Item |
Symbol |
Absolute Maximum Rating |
Unit |
Forward Current |
IF |
90 |
mA |
*1Pulse Forward Current |
IFP |
300 |
mA |
Power Dissipation |
PD |
270 |
mW |
Junction Temperature |
Tj |
110 |
|
Operating Temperature |
Topr |
-30∼+85 |
|
Storage Temperature |
Tstg |
-40∼+100 |
|
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |