Features: • Package : SMD Top View Type(2Chips In 1)• 3.5 * 2.8 * 1.8 mm(L*W*H) small size surface mount type• Color Coordinates : x = 0.31, y = 0.32 acc. to CIE 1931, at IF=40mA• Viewing angle : extremely wide(120˚)• Technology : InGaN• Soldering methods :...
LWH1032N: Features: • Package : SMD Top View Type(2Chips In 1)• 3.5 * 2.8 * 1.8 mm(L*W*H) small size surface mount type• Color Coordinates : x = 0.31, y = 0.32 acc. to CIE 1931, at IF=40mA...
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Parameter | Symbol | Value | Unit |
Power dissipation | PD | 140 | mW |
Forward Current | IF | 40 | mA |
*1Peak Forward Current | IFP | 200 | mA |
Reverse Voltage | VR | 5 | V |
Operating Temperature | Topr | -30∼+85 | |
Storage Temperature | Tstg | -40∼+100 | |
Reflow Soldering Temperature | Tsol | Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |