LSC3X00

Features:

• Low Cost Plastic Package (14 Pin DIL)

• LSC3300: 100 mW (-10 dBm) Min. Power Output LSC3100: 1 mW (0 dBm) Min. Power Output

• 1280 - 1330 nm Wavelength

• Hermetic Laser Module

• -40°C to +85°C Operation


Application

• Telecommunications

• Local Area and Metropolitan Area Networks

• Point to Point Datacommunications

• Fiber Optic Sensors • Cable Television

• Military Communications and Control Systems

• Instrumentation


Specifications

Parameter	Symbol	Conditions	LSC3300		LSC3100		Units
			Min.	Max.	Min.	Max.
LASER		CW, Tc = 25°C, Pf = Pfmin. unless otherwise stated
Threshold Current	Ith		5	35	5	35	mA
Peak Optical Output Power	Pf		100	-	1000	-	mW
Optical Output Power	Pth	Pth = Pf @ Ith -2 mA	-	10	-	50	mW
Slope Efficiency	h		4	16	40	100	mW/mA
Forward Voltage	V f		-	1.8	-	1.8	V
Differential Resistance	R d	dV/dI	-	10	-	10	W
Centre Wavelength	l c	Note 1	1280	1330	1280	1330	nm
Ic Change with Temperature	Dl/D T	Tc = -40°C to 85°C	-	0.5	-	0.5	nm/°C
Linewidth	D l	FWHM (2.35s)	-	5	-	5	nm
Rise Time	tr	10% to 90%: Ith to Pf = Pf min.	-	0.5	-	0.5	ns
Fall Time	tf	90% to 10%: Pf = Pf min. to Ith	-	0.5	-	0.5	ns
Small Signal	Bw	Pf = Pf min., ± 3 dB	1.0	-	1.0	-	GHz

Description

LSC3X00 laser modules are high reliability fiber optic light sources operating in the 1300 nanometer band. They are particularly well suited for applications where low power dissipation is required.

The internal semiconductor lasers are based upon InGaAsP buried heterostructure (BH) technology and fabricated by the Metal- Organic Vapor Phase Epitaxy (MOVPE) process, resulting in long lifetimes and modest threshold currents.

The LSC3X00 package includes a photodiode for monitoring the laser output. A longhorn type heatsink mounting flange is incorporated in the industry standard 14 pin DIL package.

Two basic varieties are offered for alternative power ranges. The "low power" LSC3300 covers the power range between 100 mW and 625 mW.The "high power" LSC3100 uses the same laser chip, but with tighter fiber coupling to achieve output powers from 1 mW to 2.5 mW.

The low cost  LSC3X00 outer package is made feasible by our unique design of hermetic miniature laser submodule which houses the electro-optic devices. The submodule concept is used as a building block in many other Hewlett-Packard products including cooled 1 mW 14 pin lasers and DFB modules.