Features: · Ultra small micro SMD 24 bump package· 6-signal level translation 1.8 V to 2.85 V· LDO stable with ceramic and high quality tantalum capacitorsSpecificationsIf Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ istributors for ava...
LP3929: Features: · Ultra small micro SMD 24 bump package· 6-signal level translation 1.8 V to 2.85 V· LDO stable with ceramic and high quality tantalum capacitorsSpecificationsIf Military/Aerospace specifi...
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If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ istributors for availability and specifications.
Supply Voltage (VBAT) −0.3V to +6.0V
Supply Voltage (VDDA) −0.3V to +3.3V
LVCMOS A Port Input Voltage −0.3V to VDDA + 0.3V
LVCMOS A Port I/O Voltage −0.3V to VDDA + 0.3V
LVCMOS A Port I/O Voltage −0.3V to VDDB + 0.3V
Junction Temperature 150
Storage Temperature −65 to +150
Lead Temperature (Note 13) 235
Pad Temperature (Note 13) 235
Derate micro SMD
Package above 25 22.9 mW/
Maximum Power Dissipation Capacity at 25
micro SMD 2.8 W
ESD Rating
HBM, 1.5k, 100pF ± 2kV
EIAJ, 0, 200pF ± 200V
IEC61000-4-2, 330, 150pF,
Air Gap, B Side (Note 2) ± 15kV
IEC61000-4-2, 330, 150pF,
Direct Contact, B Side (Note 2) ± 8kV
The LP3929 is designed for portable and wireless applications requiring level translation and power supply generation in a compact footprint.
The LP3929 level translates 1.8 V LVCMOS on the host (A) side to 2.85 V LVCMOS levels on the card (B) side for a miniSD / SD 4-bit bi-directional data bus.
Independent direct control of the CMD, Data0 and Data1-3 paths support mini SD state machine requirements. A shutdown pin is provided for the level shifters and regulator. The f_CLK_A is a feedback clock to the host which can be used to overcome level shifter bus delay.
The built-in low-dropout voltage regulator is ideal for mobile phone and battery powered wireless applications. It provides up to 200 mA from a 3.05 V to 5.5 V input. It is stable with small 1.0 F ±30% ceramic and high quality tantalum output capacitors, requiring smallest possible PC board area.
The card (B port) side channels have integration of ASIP (Application Specific Integrated Passives) - on chip integrated pull-up, pull-down, series resistors and capacitors for EMC filtering. It is designed to tolerate IEC61000-4-2 level 4 ESD: ±15 kV air discharge, ±8 kV direct contact.