LMV1032

PinoutSpecificationsSNR61, 58 dBNoise A-Wt-97, -80, -89 dBVAmp Gain25, 6, 15 dBInterfaceAnalog 3-WireSupply Current Per Channel0.065 mASupply Min1.7 VoltSupply Max5 VoltTemperature Min-40 deg CTemperature Max85 deg C View Using CatalogDescriptionThe LMV1032s are an audio amplifier series for small...

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SeekIC No. : 004397197 Detail

LMV1032: PinoutSpecificationsSNR61, 58 dBNoise A-Wt-97, -80, -89 dBVAmp Gain25, 6, 15 dBInterfaceAnalog 3-WireSupply Current Per Channel0.065 mASupply Min1.7 VoltSupply Max5 VoltTemperature Min-40 deg CTempe...

floor Price/Ceiling Price

Part Number:
LMV1032
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/26

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Product Details

Description



Pinout




Specifications

SNR61, 58 dB
Noise A-Wt-97, -80, -89 dBV
Amp Gain25, 6, 15 dB
InterfaceAnalog 3-Wire
Supply Current Per Channel0.065 mA
Supply Min1.7 Volt
Supply Max5 Volt
Temperature Min-40 deg C
Temperature Max85 deg C
View Using Catalog



Description

The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is guaranteed for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB.

The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature.

The devices are offered in space saving 4-bump ultra thin micro SMD (TM) lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This micro SMD technology is designed for microphone PCBs requiring 1 kg adhesion criteria.

Reliability Metrics


Part Number Process EFR Reject EFR Sample Size PPM LTA Rejects LTA Device Hours FITS MTTF (Hours)
LMV1032UPX-06 CMOS7 0 16561 0 0 954000 4 270700104
LMV1032UPX-15 CMOS7 0 16561 0 0 954000 4 270700104
LMV1032UPX-25 CMOS7 0 16561 0 0 954000 4 270700104
LMV1032UR-15 CMOS7 0 16561 0 0 954000 4 270700104
LMV1032UR-25 CMOS7 0 16561 0 0 954000 4 270700104
LMV1032URX-15 CMOS7 0 16561 0 0 954000 4 270700104
LMV1032URX-25 CMOS7 0 16561 0 0 954000 4 270700104

Note: The Early Failure Rates (EFR) were calculated as point estimate PPM based on rejects and sample size for EFR. The Long Term Failure Rates were calculated at 60% confidence using the Arrhenius equation at 0.7eV activation energy and derating the assumed stress temperature of 150°C to an application temperature of 55°C.

For more information on Reliability Metrics, please click here.


Design Tools


Title Size in Kbytes Date    
Microphone Amplifiers Resources 10 Kbytes 7-Mar-2007 View    

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