LMV1015

PinoutSpecificationsSNR61, 60 dBNoise A-Wt-82, -89 dBVAmp Gain15.6, 23.8 dBInterfaceAnalog Two WireSupply Current Per Channel0.141, 0.18 mASupply Min2 VoltSupply Max5 VoltSpecial FeaturesRF ImmunuityTemperature Min-40 deg CTemperature Max85 deg C View Using CatalogDescriptionThe LMV1015 is an audi...

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SeekIC No. : 004397185 Detail

LMV1015: PinoutSpecificationsSNR61, 60 dBNoise A-Wt-82, -89 dBVAmp Gain15.6, 23.8 dBInterfaceAnalog Two WireSupply Current Per Channel0.141, 0.18 mASupply Min2 VoltSupply Max5 VoltSpecial FeaturesRF Immunuit...

floor Price/Ceiling Price

Part Number:
LMV1015
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Pinout




Specifications

SNR61, 60 dB
Noise A-Wt-82, -89 dBV
Amp Gain15.6, 23.8 dB
InterfaceAnalog Two Wire
Supply Current Per Channel0.141, 0.18 mA
Supply Min2 Volt
Supply Max5 Volt
Special FeaturesRF Immunuity
Temperature Min-40 deg C
Temperature Max85 deg C
View Using Catalog



Description

The LMV1015 is an audio amplifier series for small form factor electret microphones. This 2-wire portfolio is designed to replace the JFET amplifier. The LMV1015 series is ideally suited for applications requiring high signal integrity in the presence of ambient or RF noise, such as in cellular communications. The LMV1015 audio amplifiers are guaranteed to operate over a 2.2V to 5.0V supply voltage range with fixed gains of 15.6 dB and 23.8 dB. The devices offer excellent THD, gain accuracy and temperature stability as compared to a JFET microphone.

The LMV1015 series enables a two-pin electret microphone solution, which provides direct pin-to-pin compatibility with the existing older JFET market.

National Semiconductors built-in gain families are offered in extremely thin space saving 4-bump micro SMD packages (0.3 mm maximum). The LMV1015XR is designed for 1.0 mm ECM canisters and thicker. These extremely miniature packages have the Large Dome Bump (LDB) technology. This micro SMD technology is designed for microphone PCBs requiring 1 kg adhesion criteria.

Reliability Metrics


Part Number Process EFR Reject EFR Sample Size PPM LTA Rejects LTA Device Hours FITS MTTF (Hours)
LMV1015URX-15 CMOS7 0 16561 0 0 954000 4 270700104
LMV1015URX-25 CMOS7 0 16561 0 0 954000 4 270700104
LMV1015XRX-15 CMOS7 0 16561 0 0 954000 4 270700104
LMV1015XRX-25 CMOS7 0 16561 0 0 954000 4 270700104

Note: The Early Failure Rates (EFR) were calculated as point estimate PPM based on rejects and sample size for EFR. The Long Term Failure Rates were calculated at 60% confidence using the Arrhenius equation at 0.7eV activation energy and derating the assumed stress temperature of 150°C to an application temperature of 55°C.

For more information on Reliability Metrics, please click here.


Design Tools


Title Size in Kbytes Date    
Microphone Amplifiers Resources 10 Kbytes 7-Mar-2007 View    

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