LM2502

Features: ` 320 Mbps Dual Link Raw Throughput` MPL Physical Layer (MPL-0)` Pin selectable Master / Slave mode` Frequency Reference Transport` Complete LVCMOS / MPL Translation` CPU Interface Modes:- 16-bit data path- Intel or Motorola Interface` Link power down mode reduces quiescent power under&#...

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LM2502 Picture
SeekIC No. : 004394871 Detail

LM2502: Features: ` 320 Mbps Dual Link Raw Throughput` MPL Physical Layer (MPL-0)` Pin selectable Master / Slave mode` Frequency Reference Transport` Complete LVCMOS / MPL Translation` CPU Interface Modes:-...

floor Price/Ceiling Price

Part Number:
LM2502
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

` 320 Mbps Dual Link Raw Throughput
` MPL Physical Layer (MPL-0)
` Pin selectable Master / Slave mode
` Frequency Reference Transport
` Complete LVCMOS / MPL Translation
` CPU Interface Modes:
- 16-bit data path
- Intel or Motorola Interface
` Link power down mode reduces quiescent power under∼ 10 A (actual TBD)
` Dual Display Support (CS1* & CS2*)
` Via-less MPL interconnect feature
`3.0V Supply Voltage
`Interfaces to 1.7V to 3.3V Logic



Specifications

If Military/Aerospace specified devices are required,please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (VDDA) ...................................−0.3V to +TBDV
Supply Voltage (VDD) ....................................−0.3V to +TBDV
Supply Voltage (VDDIO) ................................−0.3V to +TBDV
LVCMOS Input/Output Voltage .........−0.3V to (VDDIO+0.3V)
MPL Input/Output Voltage ..............................................TBD
Junction Temperature............................................. +150°C
Storage Temperature .............................−65°C to +150°C
Lead Temperature Soldering,4 Seconds................. +260°C
ESD Ratings:HBM, 1.5 k, 100pF............................ ±2 kV
EIAJ, 0, 200 pF.................................................... ±200V
Maximum Package Power Dissipation Capacity at 25°C
TBD Package .............................................................TBD W
Derate TBD Package above 25°C ..................TBD mW/°C




Description

The LM2502 device is a dual link Transceiver that adapts existing CPU / video busses to a low power current-mode serial MPL link.

The Master Transceiver resides beside an application processor or baseband processor and translates a parallel bus from LVCMOS levels to serial MPL levels for transmission over a flex cable and PCB traces to the Slave Transceiver located near the display module.

Dual display support is provided for a primary and sub display through the use of two ChipSelect signals.The Power_Down (PD*) input controls the power state of the MPL interface. When PD* is asserted on the Master, the MD1/0 and MC signals are powered down to save current.

The LM2502 implements the physical layer of the MPL Standard (MPL-0). The MPL logic layer is currently in definition.




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