Features: • ARM922T™ Core: 32-bit ARM9TDMI™ RISC Core 16KB Cache: 8KB Instruction Cache and8KB Data Cache MMU (Windows CE Enabled)• High Performance (200 MHz)• 80KB On-Chip Memory• External Bus Interface 100 MHz Asynchronous SRAM/ROM/Flash Synchronous DRAM...
LH7A400: Features: • ARM922T™ Core: 32-bit ARM9TDMI™ RISC Core 16KB Cache: 8KB Instruction Cache and8KB Data Cache MMU (Windows CE Enabled)• High Performance (200 MHz)• 80KB ...
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• ARM922T™ Core:
32-bit ARM9TDMI™ RISC Core
16KB Cache: 8KB Instruction Cache and
8KB Data Cache
MMU (Windows CE Enabled)
• High Performance (200 MHz)
• 80KB On-Chip Memory
• External Bus Interface
100 MHz
Asynchronous SRAM/ROM/Flash
Synchronous DRAM/Flash
PCMCIA
CompactFlash
• Clock and Power Management
32.768 kHz and 14.7456 MHz Oscillators
Programmable PLL
• Low Power Modes
Run (147 mA), Halt (41 mA), Standby (42 A)
• Programmable LCD Controller
Up to 1,024 * 768 Resolution
Supports STN, Color STN, AD-TFT, HR-TFT, TFT
Up to 64,000 Colors and 15 Gray Shades
• DMA (10 Channels)
AC97
MMC
USB
• USB Device Interface (USB 1.1)
• Synchronous Serial Port (SSP)
Motorola SPI™
Texas Instruments SSI
National MICROWIRE™
• Three Programmable Timers
• Three UARTs
Classic IrDA (115 kbit/s)
• Smart Card Interface (ISO7816)
• DC-to-DC Converters
• MultiMediaCard™ Interface
• AC97 Codec Interface
• Smart Battery Monitor Interface
• Real Time Clock (RTC)
• Up to 60 General Purpose I/Os
• Programmable Interrupt Controller
• Watchdog Timer
• JTAG Debug Interface and Boundary Scan
• Operating Voltage
1.8 V Core
3.3 V Input/Output (1.8 V I/O Optional1)
• 5 V Tolerant Inputs (except oscillator pins2)
• Operating Temperature
0 to +70 Commercial
-40 to +85 Industrial (With Clock Frequency
Reduction1)
• 256-Ball PBGA or 256-Ball CABGA Package
PARAMETER | MINIMUM | MAXIMUM |
DC Core Supply Voltage (VDDC) | - 0.3 V | 2.4V |
DC I/O Supply Voltage (VDD) | - 0.3 V | 4.6V |
DC Analog Supply Voltage (VDDA) | - 0.3 V | 2.4V |
Storage Temperature | -55 | 125 |
The LH7A400, powered by an ARM922T, is a complete System-on-Chip with a high level of integration to satisfy a wide range of requirements and expectations.
This high degree of integration lowers overall system costs, reduces development cycle time and accelerates product introduction.