LH52258A

Features: · Fast Access Times: 20/25 ns· Low-Power Standby when Deselected· TTL Compatible I/O· 5 V ± 10% Supply· Fully-Static Operation· JEDEC Standard Pinout· Packages: 28-Pin, 300-mil DIP 28-Pin, 300-mil SOJPinoutSpecifications PARAMETER RATING VCC to VSS Potential 0.5 V to 7 V I...

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LH52258A Picture
SeekIC No. : 004394189 Detail

LH52258A: Features: · Fast Access Times: 20/25 ns· Low-Power Standby when Deselected· TTL Compatible I/O· 5 V ± 10% Supply· Fully-Static Operation· JEDEC Standard Pinout· Packages: 28-Pin, 300-mil DIP 28-Pin,...

floor Price/Ceiling Price

Part Number:
LH52258A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/30

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Product Details

Description



Features:

· Fast Access Times: 20/25 ns
· Low-Power Standby when Deselected
· TTL Compatible I/O
· 5 V ± 10% Supply
· Fully-Static Operation
· JEDEC Standard Pinout
· Packages:
    28-Pin, 300-mil DIP
    28-Pin, 300-mil SOJ




Pinout

  Connection Diagram


Specifications

PARAMETER RATING
VCC to VSS Potential 0.5 V to 7 V
Input Voltage Range 0.5 V to VCC + 0.5 V
DC Output Current 2 ± 40 mA
Storage Temperature Range 65° to 150
Power Dissipation (Package Limit) 1.0 W

NOTES:
1. Stresses greater than those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating for transient conditions only. Functional operation of the device at these or any other conditions above those indicated in the 'Operating Range' section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. Outputs should not be shorted for more than 30 seconds. No more than one output should be shorted at any time.



Description

The LH52258A is a high-speed 262,144 bit static RAM organized as 32K×8. A fast, efficient design is obtained with a CMOS periphery and a matrix constructed with polysilicon load memory cells.

This LH52258A is fully static in operation. The Chip Enable (E) control permits Read and Write operations when  active (LOW) or places the RAM in a low-power standby mode when inactive (HIGH). Standby power (ISB1) drops to its lowest level if E is raised to within 0.2 V of VCC.

Write cycles occur when both Chip Enable (E) and Write Enable (W) are LOW. Data is transferred from the DQ pins to the memory location specified by the 15 address lines. The proper use of the Output Enable control (G) can prevent bus contention.

When E is LOW and W is HIGH, a static Read will occur at the memory location specified by the address lines. G must be brought LOW to enable the outputs. Since the device is fully static in operation, new Read cycles can be performed by simply changing the address.

High-frequency design techniques should be employed to obtain the best performance from this device. Solid, low-impedance power and ground planes, with high-frequency decoupling capacitors, are recommended. Series termination of the inputs should be considered when transmission line effects occur.




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