Solid State Relays Normally Open Dual Form 1A
LH1522AACTR: Solid State Relays Normally Open Dual Form 1A
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Product Type : | PCB Mount | Mounting Style : | SMD/SMT |
Load Voltage Rating : | 200 V | Load Current Rating : | 0.2 A |
Contact Form : | 2 Form A (DPST-NO) | Output Device : | MOSFET |
Package / Case : | SMD-8 |
• Dual Channel (LH1510)
• Current Limit Protection
• l/O Isolation, 5300 V RMS
• Typical R ON 10
• Load Voltage 200 V
• Load Current 120 mA
• High Surge Capability
• Linear, AC/DC Operation
• Clean Bounce Free Switching
• Low Power Consumption
• SMD Lead Available on Tape and Reel
Absolute Maximum Ratings, T A =25
Stresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Ratings for extended periods of time can adversely affect reliability.
Ambient Temperature Range ( T A ) .................................40 to +85
Storage Temperature Range ( T stg ) .............................40 to +150
Pin Soldering Temperature (t=10 s max) ( T S ) ........................... 260
Input/Output Isolation Voltage
(t=1.0 s, I ISO =10 A max) ( V ISO ) .....................................5300 V RMS
Pole-to-Pole Isolation Voltage (S1 to S2)*
(dry air, dust free, at sea level) ..............................................1600 V
LED Continuous Forward Current ( I F ) ........................................50 mA
LED Reverse Voltage ( I R 10 A) ( V R ).....................................8.0 V
DC or Peak AC Load Voltage ( I L 50 A) ( V L ) ........................200 V
Continuous DC Load Current ( I L )
One Pole Operating.................................................................200 mA
Two Poles Operating ..............................................................140 mA
Peak Load Current (t=100 ms) (single shot) ( I P ) ............................... †
Output Power Dissipation (continuous) ( P DISS )........................600 mW
* Breakdown occurs between the output pins external to the package.
† Refer to Current Limit Performance Application Note for a discussion on relay operation during transient currents.