LF357

Features: `Replace expensive hybrid and module FET op amps`Rugged JFETs allow blow-out free handling compared with MOSFET input devices`Excellent for low noise applications using either high or ow source impedance-very low 1/f corner`Offset adjust does not degrade drift or common-mode ejection as ...

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SeekIC No. : 004393769 Detail

LF357: Features: `Replace expensive hybrid and module FET op amps`Rugged JFETs allow blow-out free handling compared with MOSFET input devices`Excellent for low noise applications using either high or ow s...

floor Price/Ceiling Price

Part Number:
LF357
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

`Replace expensive hybrid and module FET op amps
`Rugged JFETs allow blow-out free handling compared with MOSFET input devices
`Excellent for low noise applications using either high or ow source impedance-very low 1/f corner
`Offset adjust does not degrade drift or common-mode ejection as in most monolithic amplifiers
`New output stage allows use of large capacitive loads 5,000 pF) without stability problems
`nternal compensation and large differential input voltage capability



Application

·Precision high speed integrators
·Fast D/A and A/D converters
·High impedance buffers
·Wideband, low noise, low drift amplifiers



Specifications

If Military/Aerospace specified devices are required, contact the National Semiconductor Sales Office/Distributors for
availability and specifications.
                                                   LF155/6              LF256/7/LF356B             LF355/6/7
Supply Voltage                               ±22V                              ±22V                    ±18V
Differential Input Voltage               ±40V                               ±40V                    ±30V
Input Voltage Range (Note 2)        ±20V                               ±20V                    ±16V
Output Short Circuit Duration Continuous                      Continuous           Continuous
TJMAX
H-Package                                       150˚C                               115˚C                    115˚C
N-Package                                                                               100˚C                    100˚C
M-Package                                                                               100˚C                    100˚C
Power Dissipation at TA = 25˚C (Notes
1, 8)
H-Package (Still Air)                       560 mW                          400 mW                400 mW
H-Package (400 LF/Min Air Flow)  1200 mW                        1000 mW              1000 mW
N-Package                                                                             670 mW                670 mW
M-Package                                                                             380 mW                380 mW
Thermal Resistance (Typical) JA
H-Package (Still Air)                       160˚C/W                          160˚C/W                160˚C/W
H-Package (400 LF/Min Air Flow)     65˚C/W                            65˚C/W                  65˚C/W
N-Package                                                                             130˚C/W                130˚C/W
M-Package                                                                             195˚C/W                195˚C/W
(Typical) JC
H-Package                                      23˚C/W                              23˚C/W                  23˚C/W
Storage Temperature Range −65˚C to +150˚C           −65˚C to +150˚C    −65˚C to +150˚C
Soldering Information (Lead Temp.)
Metal Can Package
Soldering (10 sec.)                            300˚C                                 300˚C                    300˚C
Dual-In-Line Package
Soldering (10 sec.)                            260˚C                                 260˚C                     260˚C
Small Outline Package
Vapor Phase (60 sec.)                                                                 215˚C                     215˚C
Infrared (15 sec.)                                                                        220˚C                      220˚C
See AN-450 "Surface Mounting Methods and Their Effect on Product Reliability" for other methods of
soldering surface mount devices.
ESD tolerance
(100 pF discharged through 1.5kΩ)  1000V                                1000V                      1000V




Description

These are the first monolithic JFET LF357 input operational ampli- fiers to incorporate well matched, high voltage JFETs on the same chip with standard bipolar transistors (BI-FET™ Tech- nology). These LF357 feature low input bias and offset currents/low offset voltage and offset voltage drift, coupled with offset adjust which does not degrade drift or common-mode rejection. The LF357 are also designed for high slew rate, wide bandwidth, extremely fast settling time,low voltage and current noise and a low 1/f noise corner.




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