L6237

Features: OPERATES FROM 5V SUPPLY1.5A MAXIMUM START-UP CURRENTINTEGRATED PHASES COMMUTATION SEQUENCERPROGRAMMABLESLEW RATEBACK EMF COMPARATOR OUTPUTBRAKE FUNCTION INPUT WITH USER CONFIGURABLE DELAYLOW POWER CONSUMPTION MODEOVER TEMPERATURE PROTECTIONPinoutSpecifications Symbol Parameter V...

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L6237 Picture
SeekIC No. : 004389252 Detail

L6237: Features: OPERATES FROM 5V SUPPLY1.5A MAXIMUM START-UP CURRENTINTEGRATED PHASES COMMUTATION SEQUENCERPROGRAMMABLESLEW RATEBACK EMF COMPARATOR OUTPUTBRAKE FUNCTION INPUT WITH USER CONFIGURABLE DELAYL...

floor Price/Ceiling Price

Part Number:
L6237
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/27

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Product Details

Description



Features:

OPERATES FROM 5V SUPPLY
1.5A MAXIMUM START-UP CURRENT
INTEGRATED PHASES COMMUTATION SEQUENCER
PROGRAMMABLESLEW RATE
BACK EMF COMPARATOR OUTPUT
BRAKE FUNCTION INPUT WITH USER CONFIGURABLE DELAY
LOW POWER CONSUMPTION MODE
OVER TEMPERATURE PROTECTION



Pinout

  Connection Diagram


Specifications

Symbol Parameter Value Unit
VDS(sus) Output Sustaining Voltage 14 V
VP Supply Voltage 7 V
VI Logic Input Voltage Range -0.3 to VP V
VIN Transconductance Loop Input Voltage Range -0.3 to VP V
IPEAK Peak Current (Pulsed: TON = 5ms; D.C. = 10%) Tj = 25°C 2.0 A
Tjmax Maximum Junction Temperature 145 °C
Imax Maximum Current (D.C.) 1.2 A
Ptot Total Power Dissipation at Tamb = 70°C 0.85 W
Tamb Operating Ambient Temperature -0 to 70 ÉC
Tstg Storage Temperature -40 to 150 °C



Description

The L6237 is a Triple Half bridge Driver intended for use in brushless DC motor applications. The L6237 is designed to drive a Three Phase, Brushless DC Motor, Typically used in Rigid Disk Drives. Power drivers are fabricated in DMOS Technology and feature Fast Internal Recirculation Diodes. All logic inputs are CMOS/TTL compatible, and an internal TransconductanceLoop is included for linear motor speed control. Upper NChannel DMOS Transistors are driven via an Internal Step-Up Converter. The IC will be manufactured in a plastic TQFP64 surface mount package.




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