L6100200

 Two output channels
 Integrated potential free power supply for secondary side
 Short Pulse Suppression (SPS)
 Under Voltage Protection (UVP) primary & secondary
 Under Voltage Reset (UVR)
 Drive interlock (dead time) top / bottom (DT) adjustable
 Dynamic Short Circuit Protection (DSCP) by VCE monitoring and direct switch off
 Soft Turn-Off (STO)
 Halt Logic Signal (HLS)
 Failure Management
 External Error Input
 DC bus voltage up to 1200V
 Coated with varnish

Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.

Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module.

When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector, voltage.

It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.

The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.

The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the driver leads should be twisted.

The SKYPER™ 32PRO core constitutes an interface between IGBT modules and the controller. SKYPER™ 32PRO core is a half bridge driver. Functions for driving, potential separation and protection are integrated in the driver. Thus it can be used to build up a driver solution for IGBT modules.