Features: 1. Opaque type, mini-flat package.2. Subminiature type(The volume is smaller than that of our conventional DIP type by far as 30%).3. Current transfer ratio(CTR:MIN.50% at IF=5mA, Vce=5V)4. Isolation voltage between input and output (Viso:3750Vrms).Application1. Hybrid substrates that re...
KPC357NT: Features: 1. Opaque type, mini-flat package.2. Subminiature type(The volume is smaller than that of our conventional DIP type by far as 30%).3. Current transfer ratio(CTR:MIN.50% at IF=5mA, Vce=5V)4...
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Parameter |
Symbol |
Rating |
Unit | |
Input | Forward current |
IF |
50 |
mA |
Peak forward current |
IFM |
1 |
A | |
Reverse voltage |
VR |
6 |
V | |
Power dissipation |
P |
70 |
mW | |
Output | Collector-emitter voltage |
VCEO |
60 |
V |
Emitter-collector voltage |
VECO |
5 |
V | |
Collector current |
IC |
50 |
mA | |
Collector power dissipation |
PC |
150 |
mW | |
Total power dissipation |
Ptot |
170 |
mW | |
Isolation voltage 1 minute |
Viso |
3750 |
Vrms | |
Operating temperature |
Topr |
-30 to +100 |
||
Storage temperature |
Tstg |
-40 to +125 |
||
Soldering temperature 10 second |
Tsol |
260 |