Features: • Part Identification Part number PKG Ref. CBR Ref. ROR Ref. KMM372F3200BS1 TSOP 4K 4K/64ms• Extended Data Out Mode Operation• CAS-before-RAS & Hidden Refresh capability• RAS-only refresh capability• LVTTL compatible...
KMM372F3200BS1: Features: • Part Identification Part number PKG Ref. CBR Ref. ROR Ref. KMM372F3200BS1 TSOP 4K 4K/64ms• Extended Data Out Mode Operation• CAS-b...
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Aluminum Electrolytic Capacitors - Snap In 680uF 350V 30X60
Part number |
PKG |
Ref. |
CBR Ref. |
ROR Ref. |
KMM372F3200BS1 |
TSOP |
4K |
4K/64ms |
Item |
Symbol |
Rating |
Unit |
Voltage on any pin relative to VSS Voltage on VCC supply relative to VSS Storage Temperature Power Dissipation Short Circuit Output Current |
VIN, VOUT VCC Tstg Pd IOS |
-0.5 to +4.6 -0.5 to +4.6 -55 to +125 36 50 |
V V W mA |
* Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed i n the operational sections of this data sheet. Exposure to absolute maximum rating conditions for intended periods may affect device reliability.
The Samsung KMM372F3200B1 is a 32Mx72bits Dynamic RAM high density memory module. The Samsung KMM372F3200B1 consists of thirty-six CMOS 16Mx4bits DRAMs in TSOP 400mil packages and two 16 bits driver IC in TSSOP PACKAGE mounted on a 168-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM372F3200B1 is a Dual In-line Memory Module and is intended for mounting into 168 pin edge connector sockets.