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KC73125UBA

Features: • High Sensitivity• Optical Size 1/3 inch Format• Variable Speed Electronic Shutter (1/60, 1/100 ~ 1/10,000sec)• Low Dark Current• Horizontal Register 5V Drive• 16pin Ceramic DIP Package• Field Integration Read Out System• No DC Bias on Res...

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SeekIC No. : 004384791 Detail

KC73125UBA: Features: • High Sensitivity• Optical Size 1/3 inch Format• Variable Speed Electronic Shutter (1/60, 1/100 ~ 1/10,000sec)• Low Dark Current• Horizontal Register 5V Driv...

KC73125UBA Data Sheet

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Part Number:
KC73125UBA
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/24

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Product Details

Description



Features:

• High Sensitivity
• Optical Size 1/3 inch Format
• Variable Speed Electronic Shutter
  (1/60, 1/100 ~ 1/10,000sec)
• Low Dark Current
• Horizontal Register 5V Drive
• 16pin Ceramic DIP Package
• Field Integration Read Out System
• No DC Bias on Reset Gate


Specifications

Characteristics
Symbols
Min.
Max.
Unit
Substrate voltage SUB - GND
-0.3
55
V
Supply voltage VDD, VOUT, VSS - GND
-0.3
18
V
VDD, VOUT, VSS - SUB
-55
10
V
Vertical clock input voltage V1,V2, V3, V4 - GND
-10
20
V
V1, V2, V3, V4 - VL
-0.3
30
V
V1, V2, V3, V4 - SUB
-55
10
V
Horizontal clock input voltage H1, H2 - GND
-0.3
10
V
H1, H2 - SUB
-55
17
V
Voltage dierence between vertical and
horizontal clock input pins		 V1, V2, V3, V4
15
V
27
V
H1, H2
17
V
H1, H2 - V4
-17
17
V
Output clock input voltage RS, VGG - GND
-0.3
15
V
RS, VGG - SUB
-55
10
V
Protection circuit bias voltage VL - SUB
-55
10
V
Operating temperature TOP
-10
60
°C
Storage temperature TSTG
-30
80
°C

NOTE: The device can be destroyed, if the applied voltage or temperature is higher than the absolute maximum rating voltage or temperature.




Description

The KC73125UBA is an interline transfer CCD area image sensor developed for EIA 1/3 inch optical format video cameras, surveillance cameras, object detectors and image pattern recognizers. High sensitivity is achieved through the on-chip micro lenses and HAD (Hole Accumulated Diode) photosensors. This chip features a field integration read out system and an electronic shutter with variable charge storage time.




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