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KBPC1000GS

Features: Glass Passivated Die ConstructionLow Forward Voltage DropHigh Current Capability High ReliabilityHigh Surge Current CapabilityIdeal for Printed Circuit BoardsDesigned for Saving Mounting SpaceSpecifications Characteristic Symbol KBPC1000GS KBPC1001GS KBPC1002GS KBPC...

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SeekIC No. : 004384417 Detail

KBPC1000GS: Features: Glass Passivated Die ConstructionLow Forward Voltage DropHigh Current Capability High ReliabilityHigh Surge Current CapabilityIdeal for Printed Circuit BoardsDesigned for Saving Mounting S...

KBPC1000GS Data Sheet

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Part Number:
KBPC1000GS
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

 Glass Passivated Die Construction
 Low Forward Voltage Drop
 High Current Capability 
High Reliability
 High Surge Current Capability
 Ideal for Printed Circuit Boards
 Designed for Saving Mounting Space


Specifications

Characteristic
Symbol
KBPC
1000GS
KBPC
1001GS
KBPC
1002GS
KBPC
1004GS
KBPC
1006GS
KBPC
1008GS
KBPC
1010GS
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
RMS Reverse Voltage
VR(RMS)
35
70
140
280
420
560
700
V
Average Rectified Output Current
@TA = 50°C
IO
10
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
200
A
Forward Voltage (per diode) @IF = 5.0A
VFM
1.1
V
TPeak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TA = 125°C
IR
5.0
500
A
Rating for Fusing (t < 8.3ms) (Note 1)
I2t
374
A2s
Typical Thermal Resistance (Note 2)
RJC
2.0
K/W
RMS Isolation Voltage from Case to Lead
VISO
2500
V
Operating and Storage Temperature Range
Tj,TSTG
-65 to +150

°C


Note: 1. Non-repetitive for t > 1ms and < 8.3ms.
2. Thermal resistance junction to case per element mounted on 220 x 220 x 50mm thick AL plate.




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