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KBJ801

Features: * Ideal for printed circuit board* Low forward voltage* Mounting position: Any* Low leakage currentSpecifications TYPE NUMBER KBJ801 KBJ802 KBJ803 KBJ804 KBJ805 KBJ806 KBJ807 UNITS Maximum Recurrent Peak Reverse Voltage 50 100 200 400 600 800 1000 V Maximum RMS...

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KBJ801: Features: * Ideal for printed circuit board* Low forward voltage* Mounting position: Any* Low leakage currentSpecifications TYPE NUMBER KBJ801 KBJ802 KBJ803 KBJ804 KBJ805 KBJ806 KBJ807 ...

KBJ801 Data Sheet

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Part Number:
KBJ801
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

* Ideal for printed circuit board
* Low forward voltage
* Mounting position: Any
* Low leakage current


Specifications

TYPE NUMBER KBJ801 KBJ802 KBJ803 KBJ804 KBJ805 KBJ806 KBJ807 UNITS
Maximum Recurrent Peak Reverse Voltage 50 100 200 400 600 800 1000 V
Maximum RMS Voltage 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage 50 100 200 400 600 800 1000 V
Maximum Average Forward (with heatsink Note 1)
Rectified Current at Tc=110 C (Without heatsink)		 2.9
8.0		 A
Peak Forward Surge Current, 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)		 170 A
Maximum Forward Voltage Drop per Bridge Element at 3.0A D.C. 1.0 V
Maximum DC Reverse Current Ta=25
at Rated DC Blocking Voltage Ta=100		 5.0
500		 A
A
Typical Thermal Resistance RqJC (Note 2) 2.8 /W
Typical Thermal Resistance RqJL (Note 3) 5.5 /W
Operating Temperature Range, TJ -55-- +150
Storage Temperature Range, TSTG -55-- +150
NOTES
1. Device mounted on 100mm x 100mm x 1.6mm Cu Plate Heatsink.
2. Thermal Resistance from Junction to Case with device mounted on 100mm x 100mm x 1.6mm Cu Plate Heatsink.
3. Thermal Resistance from Junction to Lead without Heatsink.


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