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KBJ2M

Features: · Diffused Junction· Low Forward Voltage Drop · High Current Capability ·High Reliability· High Surge Current Capability · Ideal for Printed Circuit BoardsSpecifications Characteristic Symbol KBJ2A KBJ2B KBJ2D KBJ2G KBJ2J KBJ2K KBJ2M Unit Peak Repetitiv...

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SeekIC No. : 004384233 Detail

KBJ2M: Features: · Diffused Junction· Low Forward Voltage Drop · High Current Capability ·High Reliability· High Surge Current Capability · Ideal for Printed Circuit BoardsSpecifications Characteris...

KBJ2M Data Sheet

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Part Number:
KBJ2M
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/30

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Product Details

Description



Features:

· Diffused Junction
· Low Forward Voltage Drop
· High Current Capability
·High Reliability
· High Surge Current Capability
· Ideal for Printed Circuit Boards


Specifications

Characteristic
Symbol
 KBJ
2A
KBJ
2B
KBJ
2D
KBJ
2G
KBJ
2J
KBJ
2K
KBJ
2M
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
RMS Reverse Voltage
VR(RMS)
35
70
140
280
420
560
700
V
Average Rectified Output Current @TA = 50°C
IO
2.0
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
50
A
I2t Rating for Fusing (t < 8.35ms)
I2t
32
A2s
Forward Voltage (per diode) @IF = 1.0A
VFM
1.0
V
Peak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TC = 100°C
IR
10
500
A
Typical Thermal Resistance (per leg) (Note 1)
RJA
47
K/W
Typical Thermal Resistance (per leg) (Note 2)
RJC
10
K/W
Operating and Storage Temperature Range
Tj,TSTG
-55 to +150
°C


Note: 1. Thermal resistance junction to ambient, mounted on PCB at 9.5mm lead length.
2. Thermal resistance junction to case, mounted on 5.0 x 4.0 x 0.8cm thick AL plate heatsink.




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