Features: · Diffused Junction·Low Forward Voltage Drop· High Current Capability· High Reliability·High Surge Current Capability ·Ideal for Printed Circuit BoardsSpecifications Characteristic Symbol KBJ10A KBJ10B KBJ10D KBJ10G KBJ10J KBJ10K KBJ10M Unit Peak Repe...
KBJ10A: Features: · Diffused Junction·Low Forward Voltage Drop· High Current Capability· High Reliability·High Surge Current Capability ·Ideal for Printed Circuit BoardsSpecifications Characteristic ...
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Characteristic |
Symbol |
KBJ10A |
KBJ10B |
KBJ10D |
KBJ10G |
KBJ10J |
KBJ10K |
KBJ10M |
Unit |
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage |
VRRM VRWM VR |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
RMS Reverse Voltage |
VR(RMS) |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
V |
Average Rectified Output Current @TC = 100°C @TA = 25°C |
IO |
10 3.0 |
A | ||||||
Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) |
IFSM |
170 |
A | ||||||
I2t Rating for Fusing (t < 8.35ms) |
I2t |
120 |
A2s | ||||||
Forward Voltage (per diode) @IF = 5.0A |
VFM |
1.05 |
V | ||||||
Peak Reverse Current @TA = 25°C At Rated DC Blocking Voltage @TC = 100°C |
IR |
170 |
A | ||||||
Typical Thermal Resistance (Note 1) |
RJC |
2.5 |
°C/W | ||||||
Operating and Storage Temperature Range |
Tj,TSTG |
-55 to +150 |
°C |
Note: 1. Thermal resistance junction to case, mounted on 150 x 150 x 1.6mm thick Cu plate heatsink.