Features: 1) The B series brings reduced height of protective resin for IC and enlarged paper pathway for thermal papers. Thanksto ROHM's latest LSI high integrated mounting technology and it's ultra slim driver IC.2) The B series accede the great world class low energy consumption characteristics...
KA2004-BE51A: Features: 1) The B series brings reduced height of protective resin for IC and enlarged paper pathway for thermal papers. Thanksto ROHM's latest LSI high integrated mounting technology and it's ultr...
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Features: 1) The B series brings reduced height of protective resin for IC and enlarged paper path...
Features: 1) The B series brings reduced height of protective resin for IC and enlarged paper path...
Features: 1) The B series brings reduced height of protective resin for IC and enlarged paper path...