Features: • Voltage Supply -1.8V device(K9K2GXXQ0M): 1.7V~1.95V -3.3V device(K9XXGXXUXM): 2.7 V ~3.6 V• Organization - Memory Cell Array -X8 device(K9K2G08X0M) : (256M + 8,192K)bit x 8bit -X16 device(K9K2G16X0M) : (128M + 4,096K)bit x 16bit - Data Register -X8 device(K9K2G08X0M): (2K +...
K9K2G16Q0M: Features: • Voltage Supply -1.8V device(K9K2GXXQ0M): 1.7V~1.95V -3.3V device(K9XXGXXUXM): 2.7 V ~3.6 V• Organization - Memory Cell Array -X8 device(K9K2G08X0M) : (256M + 8,192K)bit x 8bi...
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Features: • Voltage Supply -1.8V device(K9K2GXXQ0M): 1.7V~1.95V -3.3V device(K9XXGXXUXM): 2....
Features: · Voltage Supply-1.8V device(K9F1GXXQ0M): 1.70V~1.95V-3.3V device(K9F1GXXU0M): 2.7 V ~3....
Features: · Voltage Supply-1.8V device(K9F1GXXQ0M): 1.70V~1.95V-3.3V device(K9F1GXXU0M): 2.7 V ~3....
Parameter | Symbol |
Rating |
Unit | ||
K9K2GXXQ0M(1.8V) |
K9XXGXXUXM(3.3V) | ||||
Voltage on any pin relative to VSS | VIN/OUT |
-0.6 to + 2.45 |
-0.6 to + 4.6 |
V | |
VCC |
-0.2 to + 2.45 |
-0.6 to + 4.6 | |||
Temperature Under Bias | K9XXGXXXXM-XCB0 | TBIAS |
-10 to +125 |
||
K9XXGXXXXM-XIB0 |
-40 to +125 | ||||
Storage Temperature | K9XXGXXXXM-XCB0 | TSTG |
-65 to +150 |
||
K9XXGXXXXM-XIB0 | |||||
Short Circuit Current | IOS |
5 |
mA |
Offered in 256Mx8bit or 128Mx16bit, the K9K2GXXX0M is 2G bit with spare 64M bit capacity. Its NAND cell provides the most costeffective solution for the solid state mass storage market. A program operation can be performed in typical 300s on the 2112-byte(X8 device) or 1056-word(X16 device) page and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) or 64Kword( X16 device) block. Data in the data page can be read out at 80ns(1.8V device) or 50ns(3.3V device) cycle time per byte(X8 device) or word(X16 device). The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9K2GXXX0Ms extended reliability of 100K program/ erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9K2GXXX0M is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility. An ultra high density solution having two 2Gb stacked with two chip selects is also available in standard TSOPI package.