Features: • 3.3V power supply• LVTTL compatible with multiplexed address• Dual banks operation• MRS cycle with address key programs-. CAS Latency ( 2 & 3)-. Burst Length (1, 2, 4, 8 & full page)-. Burst Type (Sequential & Interleave)• All inputs are sample...
K4S161622D-TI/E: Features: • 3.3V power supply• LVTTL compatible with multiplexed address• Dual banks operation• MRS cycle with address key programs-. CAS Latency ( 2 & 3)-. Burst Length ...
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Features: • JEDEC standard 3.3V power supply• LVTTL compatible with multiplexed addres...
Features: • 3.3V power supply• LVTTL compatible with multiplexed address• Dual b...
Features: • 3.3V power supply• LVTTL compatible with multiplexed address• Dual b...
• 3.3V power supply
• LVTTL compatible with multiplexed address
• Dual banks operation
• MRS cycle with address key programs
-. CAS Latency ( 2 & 3)
-. Burst Length (1, 2, 4, 8 & full page)
-. Burst Type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system clock
• Burst Read Single-bit Write operation
• DQM for masking
• Auto & self refresh
• 15.6us refresh duty cycle (2K/32ms)
• Extended temperature range : -25°C to +85°C
• Industrial temperature range : -40°C to +85°C
Parameter | Symbol | Value | Unit |
Voltage on any pin relative to Vss | VIN, VOUT | -1.0 ~ 4.6 | V |
Voltage on VDD supply relative to Vss | VDD ,VDDQ | -1.0 ~ 4.6 | V |
Storage temperature | TSTG | -55 ~ +150 | °C |
Power dissipation | PD | 1.0 | W |
Short circuit current | IOS | 50 | mA |
Note :
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
The K4S161622D-TI/E is 16,777,216 bits synchronous high data rate Dynamic RAM organized as 2 x 524,288 words by 16 bits,fabricated with SAMSUNGs high performance CMOS technology.Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.