Features: • International standard package• Isolation voltage 3000V (RMS)• Low RDS (on) HDMOSTM process• Rugged polysilicon gate cell structure• Low drain-to-case capacitance (<100 pF) - reduced RFI• Low package inductance (< 10 nH) - easy to drive and to ...
IXTN58N50: Features: • International standard package• Isolation voltage 3000V (RMS)• Low RDS (on) HDMOSTM process• Rugged polysilicon gate cell structure• Low drain-to-case capac...
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Symbol | Test Conditions | Maximum | Ratings |
VCES VCGR |
TJ = 25 to 150 600 TJ= 25 to 150 ; RGE = 1 M |
500 500 |
V |
VGES VGEM |
Transient | ±20 ±30 |
V V |
ID25 IDM |
TC = 25 TC = 25, pulse width limited by TJM |
58 61 232 244 |
AA A A A |
PD | TC = 25 | 360 | W |
TJ TJM Tstg |
-40 ... +150 150 -40 ... +150 |
°C °C °C | |
TL | 1.6 mm (0.062 in.) from case for 10 s | 300 | °C |
VISOL | 50/60 Hz, RMS t = 1 minute t = 1s |
2500 3000 |
V~ V~ |
Md | Mounting torque Terminal connection torque (M4) |
1.5/13 1.5/13 |
Nm/lb.in. Nm/lb.in. |
Weight | 30 | g |