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ISP321-1-88XSM

Features: ` Options :- 10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no.` High Current Transfer Ratio ( 80 - 400% )` High Isolation Voltage (5.3kVRMS ,7.5kVPK )` High BVCEO ( 80Vmin )` All electrical parameters 100% tested` E...

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ISP321-1-88XSM: Features: ` Options :- 10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no.` High Current Transfer Ratio ( 80 - 400% )` High Iso...

ISP321-1-88XSM Data Sheet

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Part Number:
ISP321-1-88XSM
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

` Options :-
  10mm lead spread - add G after part no.
  Surface mount - add SM after part no.
  Tape&reel - add SMT&R after part no.
` High Current Transfer Ratio ( 80 - 400% )
` High Isolation Voltage (5.3kVRMS ,7.5kVPK )
` High BVCEO ( 80Vmin )
` All electrical parameters 100% tested
` External Creepage7mm


Application

·Industrial systems controllers
·Measuring instruments
·Signal transmission between systems of different potentials and impedances


Specifications

Storage Temperature.................... -55°C to + 125°C
Operating Temperature .................-55°C to + 100°C
Lead Soldering Temperature
(1/16 inch (1.6mm) from case for 10 secs)...... 260°C
INPUT DIODE
Forward Current.............................................. 50mA
Reverse Voltage ...................................................6V
Power Dissipation ...........................................70mW
OUTPUT TRANSISTOR
Collector-emitter Voltage BVCEO .........................80V
Emitter-collector Voltage BVECO ............................6V
Power Dissipation......................................... 150mW
POWER DISSIPATION
Total Power Dissipation................................ 200mW
(derate linearly 2.67mW/°C above 25°C)


Description

The ISP321-1-88XSM is an optically coupled isolator consisting of infrared light emitting diodes and NPN silicon photo transistors in a space efficient dual in line plastic package.




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