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ISO264TM

Features: · Silicon chip on Direct-Copper-Bond substrate- High power dissipation- Isolated mounting surface- 2500V electrical isolation· 3RD generation CoolMOS power MOSFET- High blocking capability- Low on resistance- Avalanche rated for unclamped inductive switching (UIS)· Low thermal resistance...

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SeekIC No. : 004380824 Detail

ISO264TM: Features: · Silicon chip on Direct-Copper-Bond substrate- High power dissipation- Isolated mounting surface- 2500V electrical isolation· 3RD generation CoolMOS power MOSFET- High blocking capability...

ISO264TM Data Sheet

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Part Number:
ISO264TM
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

·  Silicon chip on Direct-Copper-Bond substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
·  3RD generation CoolMOS power MOSFET
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped inductive switching (UIS)
·  Low thermal resistance due to reduced chip thickness
·  Low drain to tab capacitance(<40pF)


Application

·  Switched Mode Power Supplies (SMPS)
·  Uninterruptible Power Supplies (UPS)
·  Power Factor Correction (PFC)
·  Welding
·  Inductive Heating


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