Features: • High-speed access times: 8, 10, 20 ns• High-performance, low-power CMOS process• Multiple center power and ground pins for greater noise immunity• Easy memory expansion with CE and OE options• CE power-down• Fully static operation: no clock or refres...
IS61WV20488BLL: Features: • High-speed access times: 8, 10, 20 ns• High-performance, low-power CMOS process• Multiple center power and ground pins for greater noise immunity• Easy memory exp...
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Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Symbol | Parameter | Value | Unit |
VTERM | Terminal Voltage with Respect to GND | 0.5 to VDD + 0.5 | V |
VDD | VDD Relates to GND | 0.3 to 4.0 | V |
TSTG | Storage Temperature | 65 to +150 | |
PT | Power Dissipation | 1.0 | W |
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
The ISSI IS61WV20488ALL/BLL and IS64WV20488BLL are very high-speed, low power, 2M-word by 8-bit CMOS static RAM. The IS61WV20488ALL/BLL and IS64WV20488BLL are fabricated using ISSI's highperformance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields higher performance and low power consumption devices.
When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels.
The IS61WV20488ALL/BLL and IS64WV20488BLL operate from a single power supply and all inputs are TTL-compatible.
The IS61WV20488ALL/BLL and IS64WV20488BLL are available in 48 ball mini BGA and 44-pin TSOP (Type II) packages.