Features: •High-speed access time: 10, 12, 15, and 20 ns•CMOS low power operation- 130 mW (typical) operating- 150 µW (typical) standby•TTL compatible interface levels•Single 3.3V + 10%, 5% power supply for 10and 12 ns•Single 3.3V ± 10% power supply for 15and 20...
IS61LV3216L: Features: •High-speed access time: 10, 12, 15, and 20 ns•CMOS low power operation- 130 mW (typical) operating- 150 µW (typical) standby•TTL compatible interface levels•...
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Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Features: • Internal self-timed write cycle• Individual Byte Write Control and Global ...
Symbol |
Parameter |
Value |
Unit |
VCC |
Supply Voltage with Respect to GND |
0.5 to +4.6 |
V |
VTERM |
Terminal Voltage with Respect to GND |
0.5 to Vcc + 0.5 |
V |
TSTG |
Storage Temperature |
65 to +150 |
°C |
PT |
Power Dissipation |
1.0 |
W |
IOUT |
DC Output Current (LOW) |
20 |
mA |
The ISSI IS61LV3216L is a high-speed, 512K static RAM organized as 32,768 words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reli-able process coupled with innovative circuit design tech-niques, yields fast access times with low power consumption.
When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down to 150 µW (typical) with CMOS input levels.
Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW WriteEnable (WE) controls both writing and reading of the memory.A data byte allows Upper Byte (UB) and Lower Byte (LB) access.
The IS61LV3216L is packaged in the JEDEC standard 44-pin 400-mil SOJ and 44-pin TSOP (Type II).