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IS202

Features: · Options :-10mm lead spread - add G after part no.Surface mount - add SM after part no.Tape&reel - add SMT&R after part no.· High Isolation Voltage (5.3kVRMS ,7.5kVPK )· High BVCEO (70V min)· All electrical parameter 100% tested· Custom electrical selections availableApplication...

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SeekIC No. : 004378883 Detail

IS202: Features: · Options :-10mm lead spread - add G after part no.Surface mount - add SM after part no.Tape&reel - add SMT&R after part no.· High Isolation Voltage (5.3kVRMS ,7.5kVPK )· High BVCE...

IS202 Data Sheet

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Part Number:
IS202
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/26

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Product Details

Description



Features:

· Options :-
10mm lead spread - add G after part no.
Surface mount - add SM after part no.
Tape&reel - add SMT&R after part no.
· High Isolation Voltage (5.3kVRMS ,7.5kVPK )
· High BVCEO (70V min)
· All electrical parameter 100% tested
· Custom electrical selections available




Application

· Computer terminals
· Industrial systems controllers
·Signal transmission between systems of different potentials and impedances




Specifications

Storage Temperature .....................-40°C to + 125°C
Operating Temperature .................-.25°C to + 100°C
Lead Soldering Temperature
(1/16 inch (1.6mm) from case for 10 secs) .......260°C
INPUT DIODE
Forward Current............................................... 50mA
Reverse Voltage.................................................... 6V
Power Dissipation ............................................70mW
OUTPUT TRANSISTOR
Collector-emitter Voltage BVCEO ..........................70V
Emitter-collector Voltage BVECO .............................6V
Power Dissipation ..........................................150mW
Total Power Dissipation .................................170mW
(derate linearly 2.67mW/°C above 25°C)






Description

The IS202*, ISD20*, ISQ20* series of optically coupled isolators consist of infrared light emitting diodes and NPN silicon photo transistors in space efficient dual in line plastic packages.






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