DescriptionThe IRPT1059C provides the complete conversion function for a 1hp (0.75kW) variable frequency, variable voltage, AC motor controller. The combines a power module IRPT1059A with a Driver-Plus Board IRPT1059D. Figure 1 shows the block diagram of the within an AC motor control system.The p...
IRPT1059: DescriptionThe IRPT1059C provides the complete conversion function for a 1hp (0.75kW) variable frequency, variable voltage, AC motor controller. The combines a power module IRPT1059A with a Driver-P...
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The IRPT1059C provides the complete conversion function for a 1hp (0.75kW) variable frequency, variable voltage, AC motor controller. The combines a power module IRPT1059A with a Driver-Plus Board IRPT1059D. Figure 1 shows the block diagram of the within an AC motor control system.
The power module contains a single-phase input bridge rectifier, 3-phase IGBT inverter IRPT1059 , current sense shunts, and a thermistor. It is designed for easy mounting to a heat sink. The Driver-Plus Board contains DC link capacitors, capacitor soft charge function using NTC thermistor, surge suppression MOV, IGBT gate drivers, DC bus voltage and current feedback signals, protection circuitry and local power supply. It is designed to mate with a controller board through a single row header. Terminal blocks are provided on the Driver-Plus Board for all end user line input and motor output.
IRPT1059 Output power is Pulse-Width Modulated (PWM) 3-phase, variable frequency, variable voltage controlled by an externally generated user-provided PWM controller for inverter IGBT switching. The power supply offers the user non-isolated 5V and 15V to power the micro-controller.
The IRPT1059C offers several benefits to the drive manufacturer listed below:
It greatly simplifies component selection, design of layout, interconnection, gate drive, local power supply, thermal sensing, current sensing and protection.
Gate drive and protection circuits are designed to closely match the operating characteristics of the power semiconductors. This allows power losses to be minimized and power rating to be maximized to a greater extent than is possible by designing with individual components.
It reduces the effort of calculating and evaluating power semiconductor losses and junction temperature.
It reduces the manufacturer's part inventory and simplifies assembly.