IRKT71_10AS90

Features:

High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V_RMS isolating voltage


Description

The Generation V of Add-A-pak module IRKT71_10AS90 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate IRKT71_10AS90 allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module IRKT71_10AS90  is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals IRKT71_10AS90 are secured against axial pull-out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.