IRK.71

The Generation V of Add-A-pak module IRK.71 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate IRK.71 allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module IRK.71 is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals IRK.71 are secured against axial pull-out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.