Features: ·Radiatio·Hardened up to 1 x 106 Rads (Si)·Single Event Burnout (SEB) Hardened·Single Event Gate Rupture (SEGR) Hardened·Gamma Dot (Flash X-Ray) Hardened·Neutron Tolerant·Identical Pre- and Post-Electrical Test Conditions·Repetitive Avalanche Rating·Dynamic dv/dt Rating·Simple Drive Requ...
IRH8450: Features: ·Radiatio·Hardened up to 1 x 106 Rads (Si)·Single Event Burnout (SEB) Hardened·Single Event Gate Rupture (SEGR) Hardened·Gamma Dot (Flash X-Ray) Hardened·Neutron Tolerant·Identical Pre- an...
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Parameter | Units | ||
ID @ VGS = 12V, TC = 25°C |
Continuous Drain Current |
11 |
A |
ID @ VGS = 12V, TC = 100°C |
Continuous Drain Current |
7.0 | |
IDM |
Pulsed Drain Current |
44 | |
PD @ TC = 25°C |
Max. Power Dissipation |
150 |
W |
Linear Derating Factor |
1.2 |
W/°C | |
VGS |
Gate-to-Source Voltage |
±20 |
V |
EAS |
Single Pulse Avalanche Energy |
500 |
mJ |
IAR |
Avalanche Current |
11 |
A |
EAR |
Repetitive Avalanche Energy |
15 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt |
3.5 |
V/ns |
TJ TSTG |
Operating Junction Storage Temperature Range |
-55 to 150 |
|
Lead Temperature |
300 (0.063 in. (1.6mm) from case for 10 sec.) | ||
Weight |
11.5(Typical) |
g |