Features: ·Avalanche Rugged Technology·Rugged Gate Oxide Technology·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Lower Leakage Current : 10 A (Max.) @ VDS = 200V·Low RDS(ON) : 1.169 (Typ.)Specifications Symbol Characteristic Value Units VDSS Drain-to-Source...
IRFM210A: Features: ·Avalanche Rugged Technology·Rugged Gate Oxide Technology·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Lower Leakage Current : 10 A (Max.) @ VDS = 200V·Low RDS...
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Symbol | Characteristic | Value | Units |
VDSS | Drain-to-Source Voltage | 200 | V |
ID | Continuous Drain Current (TA=25 ) | 0.77 | A |
Continuous Drain Current (TA=70 ) | 0.61 | ||
IDM | Drain Current-Pulsed | 6 | A |
VGS | Gate-to-Source Voltage | ±30 | V |
EAS | Single Pulsed Avalanche Energy | 40 | mJ |
IAR | Avalanche Current | 0.77 | A |
EAR | Repetitive Avalanche Energy | 0.2 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 5.0 | V/ns |
PD | Total Power Dissipation (TA=25 ) Linear Derating Factor |
2 0.016 |
W W/ |
TJ,TSTG | Operating Junction and Storage Temperature Range |
- 55 to +150 | |
TL | Maximum Lead Temp. for Soldering Purposes, 1/8 " from case for 5-seconds |
300 |