Features: •Avalanche Rugged Technology•Rugged Gate Oxide Technology•Lower Input Capacitance•Improved Gate Charge•Extended Safe Operating Area•Lower Leakage Current : 10 A (Max.) @ VDS = 100V•Lower RDS(ON) : 0.289 (Typ.)Specifications Symbol Param...
IRFM110A: Features: •Avalanche Rugged Technology•Rugged Gate Oxide Technology•Lower Input Capacitance•Improved Gate Charge•Extended Safe Operating Area•Lower Leakage Curren...
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Symbol |
Parameter |
Value |
Units |
VDSS |
Drain-to-Source Voltage |
100 |
V |
ID |
Continuous Drain Current (TA=25 ) |
1.5 |
A |
Continuous Drain Current (TA=70 ) |
1.19 | ||
IDM |
Pulsed Drain Current |
12 |
A |
VGS |
Gate-to-Source Voltage |
+_ 20 |
V |
EAS |
Single Pulse Avalanche Energy |
60 |
mJ |
IAR |
Avalanche Current |
1.5 |
A |
EAR |
Repetitive Avalanche Energy |
1.5 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt |
1.5 |
V/ns |
PD |
Total Power Dissipation (TA=25 ) Linear Derating Factor |
2 0.016 |
W W/ |
TJ, TSTG |
Junction and Storage Temperature Range |
-55 to + 150 |
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |