MOSFET -100V Single P-Channel HEXFET
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Transistor Polarity : | P-Channel | Drain-Source Breakdown Voltage : | - 100 V | ||
Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 19 A | ||
Resistance Drain-Source RDS (on) : | 0.2 Ohms | Configuration : | Single | ||
Maximum Operating Temperature : | + 175 C | Mounting Style : | Through Hole | ||
Package / Case : | TO-220AB | Packaging : | Tube |
IRF9540, RF1S9540SM |
UNITS | |
Drain to Source Breakdown Voltage (Note 1) . . . . . VDS | -100 | V |
Drain to Gate Voltage (RGS = 20k) (Note 1) . .. .. . . .VDGR | -100 | V |
Continuous Drain Current . . . . . . . . . . ID |
-19 | A |
TC = 100 . . . . . . . . . . . . . . . . . . ID |
-12 | A |
Pulsed Drain Current (Note 3) . . . . . . . . . IDM | -76 | A |
Gate to Source Voltage . . . . . . .. . . . . . VGS | ±20 | V |
Maximum Power Dissipation (Figure 1) . . . . . . . . PD | 150 | W |
Linear Derating Factor (Figure 1) . . . . . . . . . . . | 1 | W/ |
Single Pulse Avalanche Energy Rating (Note 4). . .. . EAS | 960 | mJ |
Operating and Storage Temperature . . . . . . . . TJ, TSTG | -55 to 175 | |
Maximum Temperature for Soldering | ||
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . .TL | 300 | |
Package Body for 10s, See Techbrief 334 . . . . . . . Tpkg | 260 |