IRF7752

MOSFET 2N-CH 30V 4.6A 8-TSSOP

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IRF7752 Picture
SeekIC No. : 003429823 Detail

IRF7752: MOSFET 2N-CH 30V 4.6A 8-TSSOP

floor Price/Ceiling Price

Part Number:
IRF7752
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Quick Details

Series: HEXFET® Manufacturer: International Rectifier
FET Type: 2 N-Channel (Dual) FET Feature: Logic Level Gate
Drain to Source Voltage (Vdss): 30V Gate-Source Cutoff Voltage : - 4.5 V
Current - Continuous Drain (Id) @ 25° C: 4.6A Rds On (Max) @ Id, Vgs: 30 mOhm @ 4.6A, 10V
Vgs(th) (Max) @ Id: 2V @ 250µA Gate Charge (Qg) @ Vgs: 9nC @ 4.5V
Input Capacitance (Ciss) @ Vds: 861pF @ 25V Power - Max: 1W
Mounting Type: Surface Mount Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 8-TSSOP    

Description

FET Feature: Logic Level Gate
Mounting Type: Surface Mount
FET Type: 2 N-Channel (Dual)
Drain to Source Voltage (Vdss): 30V
Power - Max: 1W
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 8-TSSOP
Vgs(th) (Max) @ Id: 2V @ 250µA
Current - Continuous Drain (Id) @ 25° C: 4.6A
Series: HEXFET®
Manufacturer: International Rectifier
Gate Charge (Qg) @ Vgs: 9nC @ 4.5V
Packaging: Tube
Rds On (Max) @ Id, Vgs: 30 mOhm @ 4.6A, 10V
Input Capacitance (Ciss) @ Vds: 861pF @ 25V


Features:

·Ultra Low On-Resistance
·Dual N-Channel MOSFET
·Very Small SOIC Package
·Low Profile (< 1.1mm)
·Available in Tape & Reel





Pinout

  Connection Diagram




Specifications

Parameter Max. Units
VDS Drain- Source Voltage -20 V
ID @ TC = 25 Continuous Drain Current, VGS @ 10V ±4.6 A
ID @ TC = 70 Continuous Drain Current, VGS @ 10V ±3.7
IDM Pulsed Drain Current ±37
PD @TA = 25 Power Dissipation 1.0 W
PD @TA = 70 Power Dissipation 0.64
Linear Derating Factor 8.0 W/
VGS Gate-to-Source Voltage ±12 V
TJ, TSTG Junction and Storage Temperature Range -55 to + 150





Description

HEXFET® power MOSFETs IRF7752 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design , that International Rectifier is well known for, provides thedesigner with an extremely efficient and reliable device for use in battery and load management.

The TSSOP-8 package IRF7752, has 45% less footprint area of the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium.

The low profile (<1.1mm) of the TSSOP-8 IRF7752 will allow it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards.





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