IRF7751

MOSFET 2P-CH 30V 4.5A 8-TSSOP

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IRF7751 Picture
SeekIC No. : 003429827 Detail

IRF7751: MOSFET 2P-CH 30V 4.5A 8-TSSOP

floor Price/Ceiling Price

Part Number:
IRF7751
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/8/14

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Product Details

Quick Details

Series: HEXFET® Manufacturer: International Rectifier
FET Type: 2 P-Channel (Dual) FET Feature: Logic Level Gate
Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25° C: 4.5A
Gate-Source Cutoff Voltage : - 4.5 V Rds On (Max) @ Id, Vgs: 35 mOhm @ 4.5A, 10V
Vgs(th) (Max) @ Id: 2.5V @ 250µA Gate Charge (Qg) @ Vgs: 44nC @ 10V
Input Capacitance (Ciss) @ Vds: 1464pF @ 25V Power - Max: 1W
Mounting Type: Surface Mount Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 8-TSSOP    

Description

FET Feature: Logic Level Gate
Mounting Type: Surface Mount
Vgs(th) (Max) @ Id: 2.5V @ 250µA
FET Type: 2 P-Channel (Dual)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25° C: 4.5A
Power - Max: 1W
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 8-TSSOP
Gate Charge (Qg) @ Vgs: 44nC @ 10V
Series: HEXFET®
Manufacturer: International Rectifier
Packaging: Tube
Rds On (Max) @ Id, Vgs: 35 mOhm @ 4.5A, 10V
Input Capacitance (Ciss) @ Vds: 1464pF @ 25V


Features:

·Ultra Low On-Resistance
·Dual P-Channel MOSFET
·Very Small SOIC Package
·Low Profile (< 1.2mm)
·Available in Tape & Reel





Pinout

  Connection Diagram




Specifications

Parameter Max. Units
VDS Drain- Source Voltage -30 V
ID @ TA = 25 Continuous Drain Current, VGS @ -10V -4.5 A
ID @ TA = 70 Continuous Drain Current, VGS @ -10V -3.6
IDM Pulsed Drain Current -18
PD @TA = 25 Maximum Power Dissipation 1.0 W
PD @TA = 70 Maximum Power Dissipation 0.64 W
Linear Derating Factor 0.008 W/
VGS Gate-to-Source Voltage ± 20 V
TJ, TSTG Junction and Storage Temperature Range -55 to + 150





Description

HEXFET® power MOSFETs from International Rectifier IRF7751 utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that International Rectifier is well known for, provides the designer with an extremely efficient and reliable device for use in battery and load management.

The TSSOP-8 package IRF7751 has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.2mm) allows it to fit easily into extremely thin environments such as portable electronics and PCMCIA cards.





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