IRF7750

MOSFET 2P-CH 20V 4.7A 8-TSSOP

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IRF7750 Picture
SeekIC No. : 003430151 Detail

IRF7750: MOSFET 2P-CH 20V 4.7A 8-TSSOP

floor Price/Ceiling Price

Part Number:
IRF7750
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/7/15

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Product Details

Quick Details

Series: HEXFET® Manufacturer: International Rectifier
FET Type: 2 P-Channel (Dual) FET Feature: Logic Level Gate
Drain to Source Voltage (Vdss): 20V Current - Continuous Drain (Id) @ 25° C: 4.7A
Gate-Source Cutoff Voltage : - 4.5 V Rds On (Max) @ Id, Vgs: 30 mOhm @ 4.7A, 4.5V
Vgs(th) (Max) @ Id: 1.2V @ 250µA Gate Charge (Qg) @ Vgs: 39nC @ 5V
Input Capacitance (Ciss) @ Vds: 1700pF @ 15V Power - Max: 1W
Mounting Type: Surface Mount Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 8-TSSOP    

Description

FET Feature: Logic Level Gate
Mounting Type: Surface Mount
FET Type: 2 P-Channel (Dual)
Drain to Source Voltage (Vdss): 20V
Vgs(th) (Max) @ Id: 1.2V @ 250µA
Power - Max: 1W
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 8-TSSOP
Series: HEXFET®
Manufacturer: International Rectifier
Current - Continuous Drain (Id) @ 25° C: 4.7A
Rds On (Max) @ Id, Vgs: 30 mOhm @ 4.7A, 4.5V
Gate Charge (Qg) @ Vgs: 39nC @ 5V
Input Capacitance (Ciss) @ Vds: 1700pF @ 15V
Packaging: Tube


Features:

·Ultra Low On-Resistance
·Dual P-Channel MOSFET
·Very Small SOIC Package
·Low Profile ( < 1.1mm)
·Available in Tape & Reel



Specifications

  Parameter Max. Units
VDS Drain- Source Voltage -20 V
ID @ TA = 25 Continuous Drain Current, VGS @ -4.5V ±4.7 A
ID @ TA = 70 Continuous Drain Current, VGS @ -4.5V ±3.8
IDM Pulsed Drain Current ±38
PD @TA = 25 Power Dissipation 1.0 W
PD @TA = 70 Power Dissipation 0.64
  Linear Derating Factor 0.008 W/
VGS Gate-to-Source Voltage ±20 V
TJ, TSTG Junction and Storage Temperature Range -55 to + 150



Description

HEXFET® power MOSFETs IRF7750 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that International Rectifier is well known for, provides the designer with an extremely efficient and reliable device for battery and load management.

The TSSOP-8 package IRF7750 has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) allows it to fit easily into extremely thin environments such as portable electronics and PCMCIA cards.



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