IRF7509PbF

Specifications Parameter Max Units N-Channel P-Channel VDS Drain-Source Voltage 30 -30 V ID @ TA = 25°C Continuous Drain Current, VGS 2.7 -2.0 ID @ TA = 70°C Continuous Drain Current, VGS 2.1 -1.6 A IDM Pulsed Drain Current ...

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SeekIC No. : 004376804 Detail

IRF7509PbF: Specifications Parameter Max Units N-Channel P-Channel VDS Drain-Source Voltage 30 -30 V ID @ TA = 25°C Continuous Drain Current, VGS 2.7 -2.0 ...

floor Price/Ceiling Price

Part Number:
IRF7509PbF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Specifications

  Parameter
Max
Units
   
N-Channel
P-Channel
VDS Drain-Source Voltage
30
-30
V
ID @ TA = 25°C Continuous Drain Current, VGS
2.7
-2.0
ID @ TA = 70°C Continuous Drain Current, VGS
2.1
-1.6
A
IDM Pulsed Drain Current
21
-16
PD @TA = 25°C Maximum Power Dissipation
1.25
W
PD @TA = 70°C Maximum Power Dissipation
0.8
W
  Linear Derating Factor
10
mW/°C
VGS Gate-to-Source Voltage
± 20
V
VGSM Gate-to-Source Voltage Single Pulse tp<10S
30
V
dv/dt Peak Diode Recovery dv/dt
5.0
V/ns
TJ , TSTG Junction and Storage Temperature Range
-55 to + 150
°C
  Soldering Temperature, for 10 seconds
240 (1.6mm from case)



Description

Fifth Generation HEXFETs IRF7509PbF from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The new Micro8 package IRF7509PbF, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards.




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