Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 14 A ID @ TA = 70°C Continuous Drain Current, VGS @ -10V 11 A IDM Pulsed Drain Current 110 A PD @TA = 25°C Maximum Power Dissipation 2.5 W Linear Derating Factor 0.02 mW/...
IRF7484: Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 14 A ID @ TA = 70°C Continuous Drain Current, VGS @ -10V 11 A IDM Pulsed Drain Curren...
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Parameter | Max. | Units | |
ID @ TA = 25°C | Continuous Drain Current, VGS @ -10V | 14 | A |
ID @ TA = 70°C | Continuous Drain Current, VGS @ -10V | 11 | A |
IDM | Pulsed Drain Current | 110 | A |
PD @TA = 25°C | Maximum Power Dissipation | 2.5 | W |
Linear Derating Factor | 0.02 | mW/°C | |
VGS | Gate-to-Source Voltage | ± 8 | V |
EAS | Single Pulse Avalanche Energy | 230 | mJ |
IAR | Avalanche Current | See Fig.16c, 16d, 19, 20 | A |
EAR | Repetitive Avalanche Energy | mJ | |
TJ , TSTG | Junction and Storage Temperature Range | -55 to + 150 | °C |
Specifically designed for Automotive applications, this Stripe Planar design of HEXFET® Power MOSFETs utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this HEXFET power MOSFET are a 150°C junction operating temperature, fast switching speed and improved repetitive avalanche rating. These benefits IRF7484 combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.