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IRF7416

Features: *Generation V Technology* Ultra Low On-Resistance* P-Channel Mosfet* Surface Mount* Available in Tape & Reel* Dynamic dv/dt Rating* Fast SwitchingPinoutSpecifications Parameter Max. Units ID @ TA = 25 Continuous Drain Current, VGS @ 10V -10 A ID @ TA =70 Continuous...

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SeekIC No. : 004376769 Detail

IRF7416: Features: *Generation V Technology* Ultra Low On-Resistance* P-Channel Mosfet* Surface Mount* Available in Tape & Reel* Dynamic dv/dt Rating* Fast SwitchingPinoutSpecifications Parameter ...

IRF7416 Data Sheet

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Part Number:
IRF7416
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/14

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Product Details

Description



Features:

*Generation V Technology
* Ultra Low On-Resistance
* P-Channel Mosfet
* Surface Mount
* Available in Tape & Reel
* Dynamic dv/dt Rating
* Fast Switching




Pinout

Connection Diagram




Specifications

Parameter Max. Units
ID @ TA = 25 Continuous Drain Current, VGS @ 10V -10 A
ID @ TA =70 Continuous Drain Current, VGS @ 10V -7.1
IDM Pulsed Drain Current -45
PD @ TA = 25 Power Dissipation 2.5 W
Linear Derating Factor 0.02

W/
V

VGS Gate-to-Source Voltage ± 20
EAS Single Pulse Avalanche Energy 370 mJ
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
TJ,TSTG Junction and Storage Temperature Range -55 to + 150





Description

Fifth Generation HEXFETs IRF7416 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SO-8 IRF7416 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.






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