Features: · Trench Technology· Ultra Low On-Resistance· Dual P-Channel MOSFET· Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain-Source Voltage -30 V ID @ TA = 25°C Continuous Drain Current, VGS @ -10V -8.0 A ID @ TA = 70°C Continuous Drain Current,...
IRF7328: Features: · Trench Technology· Ultra Low On-Resistance· Dual P-Channel MOSFET· Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain-Source Voltage -30 V ID @ T...
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Parameter | Max. | Units | |
VDS | Drain-Source Voltage | -30 | V |
ID @ TA = 25°C | Continuous Drain Current, VGS @ -10V | -8.0 | A |
ID @ TA = 70°C | Continuous Drain Current, VGS @ -10V | -6.4 | A |
IDM | Pulsed Drain Current | -32 | A |
PD @TA = 25°C | Maximum Power Dissipation | 2.0 | W |
PD @TA = 70°C | Maximum Power Dissipation | 1.3 | W |
Linear Derating Factor | 16 | mW/°C | |
VGS | Gate-to-Source Voltage | ± 20 | V |
TJ , TSTG | Junction and Storage Temperature Range | -55 to + 150 | °C |
New trench HEXFET® Power MOSFETs IRF7328 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in battery and load management applications.